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• Intel Arc Alchemist graphics cards may be pricier than expected

  

  25 October 2021, 10:11

  And the 'Intel 4' Meteor Lake compute tile has been successfully powered on.

  18
• AMD provides more 3D stacking info at Hot Chips 33

  

  23 August 2021, 10:11

  And a leaked document confirms AMD AM5 will support DDR5 and PCIe 4.0 (not 5.0).

  10
• Intel provides sneak peek at Xe HPG and Xe HPC GPUs

  

  19 August 2021, 14:31

  We learn about the Xe-cores, tiles, slices, caches and more.

  1
• Intel announces node renaming and roadmap to the Angstrom era

  

  26 July 2021, 22:00

  Enhanced 10nm SuperFin is to be called 'Intel 7', Intel's 7nm will be 'Intel 4', and so on.

  22
• Intel Xe-HPC GPU reaches system validation phase

  

  29 June 2021, 12:11

  And Xe-HPG is sampling with AIBs, with an announcement teased, coming "soon".

  1
• Intel announces that it has taped-in the Meteor Lake compute tile

  

  25 May 2021, 10:11

  7nm Meteor Lake processors are expected to become Intel's 14th Gen Core series CPUs.

  4
• Intel New Mexico manufacturing upgrade to cost $3.5 billion

  

  4 May 2021, 10:11

  It will concentrate on advanced packaging tech like Foveros.

  0
• Intel 7nm Meteor Lake CPU tile design to be verified next quarter

  

  24 March 2021, 10:11

  It will use Foveros packaging tech and become a volume product in 2023.

  9
• Intel brings discrete Xe GPUs to mainstream and business PCs

  

  27 January 2021, 11:11

  Meanwhile, Raja Koduri announces that the beefy Xe HPC GPU is "ready for power on".

  17
• Samsung X-Cube 3D IC packaging technology now available

  

  13 August 2020, 12:11

  Partners can leverage the chip stacking TSV tech for "leaps in speed and power efficiency".

  4
• Leaked Intel slides evidence of Alder Lake-S hybrid CPUs

  

  14 July 2020, 11:11

  10nm desktop chips said to combine up to 8 Golden Cove and 8 Gracemont cores.

  19
• Samsung Galaxy Book S (Intel Lakefield 5C/5T CPU) tested

  

  26 June 2020, 14:41

  Initial results are lack lustre: it is sometimes slower than the Snapdragon 8cx version.

  13
• Intel launches its Lakefield 3D packaged hybrid processors

  

  11 June 2020, 10:10

  It is aiming to secure a foothold in ultra-light and innovative form factors.

  9
• Samsung outs Galaxy Book S with Intel Lakefield CPU

  

  20 May 2020, 13:11

  The Intel Core i5-L16G7 processor is a hybrid 5C/5T design ala Arm big.LITTLE.

  9
• AMD set to release Navi 2X GPUs and Zen 3 CPUs in 2020

  

  6 March 2020, 06:00

  And talks Zen 4, CDNA, and Infinity Architecture at Financial Analysts Day.

  11
• Intel teases its upcoming Lakefield hybrid CPUs

  

  12 February 2020, 12:11

  12x12x1mm designs leverage Intel's Foveros 3D-stacking tech and intro mixed CPU cores.

  8
• Intel Senior Fellow predicts bright future for Moore's Law

  

  12 December 2019, 13:31

  Robert Chau optimistic about the twin vectors of monolithic scaling and system scaling.

  9
• Intel reveals Ponte Vecchio GPU for HPC/AI acceleration

  

  18 November 2019, 10:11

  GPU arch will be supported by OneAPI model, and feature in the Aurora Supercomputer.

  10
• Samsung shows off Galaxy Book Flex and Galaxy Book Ion

  

  30 October 2019, 11:21

  These premium portable designs are Samsung's first Project Athena-verified laptops.

  0
• Intel details its advanced low power Tremont microarchitecture

  

  25 October 2019, 10:11

  10nm Tremont Atom chips will bring an average 30 per cent IPC improvement says Intel.

  2
• Lenovo's foldable ThinkPad X1 hardware is ready

  

  22 October 2019, 11:11

  But it has to wait for Windows 10X before it launches its 13.3-inch flexible OLED device.

  0