Now, the Fremont outfit is fleshing out the line with high-density 8GB and 12GB packs suitable for both Core i5 and Core i7 CPUs. Looking a little deeper, the kits are suitable for Lynnfield and current Bloomfield chips, denoting dual- and triple-channel offerings.
The blue-tipped modules are 2GB in size and operate at 1,600MHz with 8-8-8-24 latencies and support Intel's XMP profiles for a simple setup. Operating voltage is a standard 1.65V.
Four DHX+ modules are packaged for the dual-channel set, suitable for P55 boards that house the LGA1156 Lynnfield chips, which are to be released next month. The 8GB kit - part number CMD8GX3M4A1600C8 - ships with a matching Airflow fan (not shown).
Present Core i7 chips are supported by the X58 chipset. Most motherboards feature six DIMM slots for tri-channel operation. The 12GB kit - part number CMD12GX3M6A1600C8 - ships with six modules, rather than four, and also include the Airflow fan.
As the actual modules are the same it's just a matter of packaging them up correctly. No word on pricing just yet, but it's good to see larger-capacity kits being made available.
