Taiwan-based GIGABYTE has recently announced Ultra Durable 3, a feature-set soon to be found on many of its forthcoming motherboards.
The technology boasts plentiful upgrades - including the use of of Japanese capacitors that boast 50,000 hours of use. Perhaps the most significant upgrade, however, is the use of 2oz copper layers for its PCBs.
According to GIGABYTE, its Ultra Durable 3 series products will become the industry’s first consumer motherboards to feature two ounces of copper for both the Power and Ground layers. The result, we're told, is dramatically lower system temperatures, improved efficiency and greater headroom for overclocking.
Doubling up on the amount of copper is said to creative efficient heat spreading, and GIGABYTE claims the innovation will lower temperatures in specific motherboard areas by up to 50°C.
Another advantage is that the added copper should help prevent motherboard warping - particularly for users with over-sized and heavy coolers. A traditional 1oz copper layer measures in at around 35µm, GIGABYTE's 2oz layers are a chunkier 70µm thick.
It all sounds promising on paper, but we won't know just how effective the extra copper is until we get our hands on a Ultra Durable 3 motherboard. Expect the technology to feature on most of GIGABYTE's upcoming boards.
Official product page: GIGABYTE.com
