VIA to Display Totally Fanless Thin PC at Computex 2002
VIA Eden(tm) Platform based Thin PC from Bona Computech
leads the trend towards silent running small form factor systems
Taipei, Taiwan, 3 June 2002 - VIA Technologies, Inc, a
leading innovator and developer of silicon chip technologies and PC platform
solutions, today announced it will display the innovative new totally fanless
Thin PC from BONA Computech Ltd <
based on the VIA Eden(tm) Platform.
Developed around the Mini-ITX form factor, the new Lex
Thin Case PC <
boasts an impressive feature set that provides users with a host of options for
small, silent PC systems. Measuring a mere 6.2cm (H) x 27.2cm (W) x 25.2cm (D),
it includes a Hard Disk Drive, DVD Drive and the option of a 60W External
Adapter power supply. Enhancing its ergonomic design, are two front panel USB
ports in addition to the remarkable connectivity offered by the VIA EPIA Mini-ITX
mainboard <http://www.viavpsd.com/product/epia_mini_itx_spec.jsp>
that powers the system.
<<...>>
"Our Mini-ITX chasses are designed to be as small and
quiet as possible while providing users with lots of expandability options,"
commented Gary Chiang, Managing Director of BONA Computech, Ltd. "The VIA
Eden(tm) Platform is perfect for small fanless connectivity systems."
"The growing interest and excitement around the VIA
Eden(tm) Platform is starting to produce results evident in the amount of new
accessories and full systems that are becoming available," noted Richard Brown,
Director of Marketing for VIA Technologies, Inc. "We are working closely with
other forward thinking partners like BONA Computech to deliver the type of
systems that the modern PC market demands."
Ultra Compact VIA EPIA Mini-ITX Mainboard
The new VIA EPIA Mini-ITX motherboard provides system
integrators and OEMs with a standardized ultra compact yet highly integrated
platform that can be utilized across multiple mini PC, Information Station,
Information Server, and Broadband Gateway product lines. With a footprint that
measures only 170mm x 170mm, the new VIA EPIA Mini-ITX motherboard is more than
33% smaller than any other motherboard form factor currently available on the
market. It also comes with a rich feature set that includes a VIA C3(tm)
processor (EBGA package), integrated AGP graphics and audio, IEEE 1394, USB 2.0,
TV-Out connector, Ethernet networking, and SPDIF 5.1 audio channels that are not
available on other small form factor motherboards.
Featuring a powerful processor core available with
native x86 execution, 192KB full speed L1/L2 cache, and MMXÔ and 3DNow!Ô
support, the EPIA Mini-ITX delivers leading edge PC application and Internet
performance on an embedded platform and is fully compatible with a complete
range of MicrosoftÒ WindowsÒ XP, Windows 9x, Embedded Windows, and Windows CE
operating systems as well as all the leading versions of Linux. The VIA Eden
Platform's multimedia performance is further enhanced by its integrated APG2X/4X
graphics with full 3D/2D/video acceleration, including motion compensation for
advanced video applications. Market-leading thermal characteristics make the VIA
EPIA Mini-ITX the ideal solution for ergonomic fanless system designs for a
variety of innovative low profile, small form factors, and translate into lower
energy costs and longer battery life in mobile designs. The EPIA Mini-ITX is
also available with the VIA Eden(tm) Platform for ultra low power Information
Appliance designs.
More information about the new ultra compact VIA EPIA
Mini-ITX mainboard can be found at <
The VIA EPIA Mini-ITX mainboard is available from VPSD distributors worldwide.
Information on the availability of VIA EPIA Mini-ITX mainboards can be found
at: <
http://www.viavpsd.com/wheretobuy/where2buy.jsp>,and the current list of Mini-ITX mainboard manufacturers can be seen at <http://www.via.com.tw/en/VInternet/mini_itx.jsp>.
Further information on the Lex Thin PC from BONA
Computech, Ltd. may be found at: <
About VIA Technologies, Inc.
VIA Technologies, Inc. is a leading innovator and
developer of PC core logic chipsets, microprocessors, and multimedia, optical
storage, communication and networking chips. VIA delivers value to the PC
industry by designing, marketing, and selling high-performance VIA Apollo core
logic chipsets for the full range of PC platforms, and cost-effective VIA C3(tm)
processors for Value PCs and Internet Appliances, as well as developing complete
solutions for the PC platform through its VPSD Business Unit. Its customers
include the world's top OEMs, mainboard manufacturers, and system integrators.
VIA is headquartered in Taipei, Taiwan, at the center of the Greater China
high-tech manufacturing engine, and has branch offices in the US, China and
Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and
achieved annual revenues of nearly US$1 billion in 2001. Additional information
can be found at
www.via.com.tw.
