With a focus on developing advanced RF technologies, the design center acquisition further augments VIA’s wireless capabilities

Taipei, Taiwan, 5 March 2003 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that it has acquired the wireless applications design center co-established with Swedish microelectronics institute Acreo in May 2001.

Located in Lund, Sweden, in the heart of one of the world’s leading research communities developing wireless technologies, the VIA wireless design center is dedicated to radio frequency (RF) technology design, adding wireless system application R&D capabilities to VIA’s extensive silicon and platform product portfolio.

“The demand for wireless Internet access is becoming ever more pervasive, so we believe the development of wireless communications is an essential element to provide customers with the necessary products to serve this market,” said Wenchi Chen, President and CEO of VIA Technologies, Inc. “In less than two years, we are reaping the benefits of our partnership with Acreo, enabling VIA to boast wireless system design capabilities as yet another important building block in our overall strategy.”

“VIA’s impressive product range will be greatly enhanced with the addition of the wireless technology R&D carried out at the VIA wireless design center,” commented Hans Hentzell, President of Acreo. “We are delighted at the success of this venture, for VIA as well as for Sweden and for Socware, our design cluster for System-on-Chip ware.”

“The VIA wireless design center is a result of the successful implementation of Socware, a Swedish Government initiative to create an international design cluster in Sweden with a focus on wireless communications. The initiative has attracted several world technology leaders to Sweden, and the cooperation with VIA Technologies, Inc. is one of the best examples to date and is a showcase for many other companies,” noted Rolf Rising, Head of the Socware Design Cluster.



About Acreo AB

Acreo is a Swedish research institute working with contract research and development to help customers develop the advanced products of tomorrow. Acreo provides innovative microelectronics and optics solutions that contribute to growth and profitability. Its different technological areas are Integrated Circuit Design, Microelectronic Process Technologies, Optical Components and Systems, Interconnect and Packaging Technologies, Robust Electronics, Sensor Technologies, Visual Interfaces and SME Services.

Acreo has long been at the forefront of system-on-package (SoP) technology, and has added strategic competence over the last few years in the area of system-on-chip (SoC) design for wireless applications. Acreo has facilities in Stockholm/Kista, Norrköping, Lund and Hudiksvall in Sweden. The department of System Level Integration is located in Norrköping and Lund. Further information can be retrieved from the Acreo website: http://www.acreo.se.

About VIA Technologies, Inc.

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communications, optical media and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at http://www.via.com.tw.