March 19, 2002 - Intel Corporation today revealed the
industry's first dual processing capabilities for thin, low-power "ultra-dense"
blade servers. Dual processor systems containing the new Low Voltage Intel®
Pentium® III processors at 800 MHz offer up to 63 percent* higher performance
versus their single processor counterparts. They also offer new server-centric
improvements including large memory support of up to four gigabytes.
"Ultra-dense" blade servers typically contain the highest number of processors
possible based on the lowest size and thermal requirements. The systems are
popular with Internet service providers and others that place a unique emphasis
on lowering energy and real estate costs. The systems are typically used for
tasks such as Web hosting and firewall protection. "Ultra-dense" blade servers
are part of the overall server blade market, which is marked by servers
containing multiple motherboards stacked either vertically or horizontally, much
like books in a bookcase. Larger blade servers are optimized for maximum
performance in high-density configurations. "Today's announcement for
dual-processing in 'ultra-dense' servers increases the capabilities for this
emerging market segment," said Richard Dracott, director, Intel Enterprise
Platforms Group. "These systems offer significant real estate, performance and
power benefits versus single processor systems."
System Specifications
Each processor inside of the new dual processor systems
contains 512 KB of on-chip level 2 cache memory (very fast memory). They are
also the first Intel-based "ultra-dense" dual processing chips to support faster
PC 133 SDRAM memory and a 133 MHz system bus.
Due to their dual processing configurations, the new
platforms received heavy testing in Intel's enterprise validation labs. They
also contain reliability features such as error correcting code and remote
manageability tools. The processors are produced in high volumes on Intel's
0.13-micron manufacturing process, an advanced process that enables low
voltages. The chips come in Intel's uFCBGA package, the latest packaging
technology for smaller systems such as high-density servers.
New blade server systems from Dell, Fujitsu-Siemens and
other major OEMs are expected later this year. System pricing varies by
manufacturer.
Applied Computing Systems
New dual processor motherboards based on the processors
are also immediately available from applied computing companies such as Force
Computers, I-Bus/Phoenix and Kontron. They are aimed at applications that
require extended life-cycle support in the communications, transportation,
automation, medical and military market segments, among others. Specifically,
the boards are optimal for security, storage, telephony and wireless
applications. These environments often require small, thermally sensitive
processors that can provide sustained concurrency, higher throughput and data
reliability. Intel, the world's largest chip maker, is also a leading
manufacturer of computer, networking and communications products. Additional
information about Intel is available at
www.intel.com/pressroom.
