VIA Introduces Highly Anticipated VIA C3(tm) 1GHz
Processor at Computex 2002
Takes "Cool Processing" across the 1GHz barrier for
small, quiet systems
Taipei, Taiwan, 3 June 2002 - VIA Technologies, Inc, a
leading innovator and developer of silicon chip technologies and PC platform
solutions, today announced the new VIA C3(tm) 1GHz series of processors.
"We have finally succeeded in providing a processor for
small and quiet 1GHz systems based on standard, off the shelf components,"
commented Paul Hsu, Special Assistant to the President, VIA Technologies, Inc.
"At twice the speed of the currently installed user base, the VIA C3(tm) 1GHz
processor is a compelling option for upgrading existing Socket 370 PCs or
building aesthetically pleasing and affordable ergonomic systems that demand
less desk real estate."
The expensive noise dampening and cooling mechanisms of
today's multi GHz systems with their massive power supplies are driving the
market to more affordable unobtrusive solutions. Recognizing this, system
designs are moving towards smaller form factors that break the traditional mould
of the large white PC box for office, home and school systems. With a typical
power consumption of a mere 5.7 watts, the VIA C3(tm) 1GHz processor only
requires a standard small fan and heat sink to operate with rock solid
reliability and stability, even in tough thermal conditions.
VIA C3(tm) 1GHz Processor
Building on the VIA C3(tm) processor's reputation for
Cool Processing, the VIA C3(tm) 1GHz processor continues to boast the world's
smallest x86 processor die size and industry leading 0.13 micron manufacturing
process, while delivering ultra low power consumption and world class levels of
stability. Other features include 128KB Level 1 and 64KB Level 2 full speed
cache, as well as support for a 100/133MHz Front Side Bus and MMX(tm) and 3DNow!
multimedia instructions, to ensure robust levels of performance for all the most
popular mainstream software and Internet applications. The VIA
C3(tm) 1GHz processor will ship at speeds from 1GHz;
pricing information is available on request. Future versions will continue to
embrace the Socket 370 form factor.
About VIA Technologies, Inc.
VIA Technologies, Inc. is a leading innovator and
developer of PC core logic chipsets, microprocessors, and multimedia, optical
storage, communication and networking chips. VIA delivers value to the PC
industry by designing, marketing, and selling high-performance VIA Apollo core
logic chipsets for the full range of PC platforms, and cost-effective VIA C3(tm)
processors for Value PCs and Internet Appliances, as well as developing complete
solutions for the PC platform through its VPSD Business Unit. Its customers
include the world's top OEMs, mainboard manufacturers, and system integrators.
VIA is headquartered in Taipei, Taiwan, at the center of the Greater China
high-tech manufacturing engine, and has branch offices in the US, China and
Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and
achieved annual revenues of nearly US$1 billion in 2001. Additional information
can be found at
www.via.com.tw.
