OCZ Technology Introduces the Latest DDR3 Kits within the Intel Extreme Memory Series
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OCZ (NASDAQ:OCZ)
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Designed to significantly increase performance levels of the entire platform, these modules feature Intel Extreme Memory Profiles (XMP), a proprietary extension of SPD (Serial Presence Detect) settings that act as an integrated “plug and play” overclocking tool. The new Extreme Memory Profile options on the new OCZ DDR3 modules allow the end user to select extreme or ultimate performance through a framework of predefined and validated optimizations of individual settings without the hassle of manually adjusting each parameter, so the timings, voltage, and speed boot automatically for maximum performance.
“We are proud to embrace Intel’s XMP specifications in the new line-up of DDR3 modules,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “XMP-Ready memory allows safe booting of the system under any circumstances while maintaining the built-in overclocking features to bring out the ultimate performance of the entire system.”
Configured to Intel’s defined specification, the latest XMP-Ready memory will be available as:
•PC3-10666 / DDR3-1333 CL7-7-7 4GB (2x2GB) Dual Channel Kit
•PC3-10666 / DDR3-1333 CL7-7-7 2GB (2x1GB) Dual Channel Kit
•PC3-12800 / DDR3-1600 CL7-7-7 4GB (2x2GB) Dual Channel Kit
•PC3-12800 / DDR3-1600 CL7-7-7 2GB (2x1GB) Dual Channel Kit
Each kit is configured to run aggressive latencies and features a second enthusiast profile to enable the modules to run at an even more aggressive balance of speed and timings. Each OCZ XMP memory module is backed by the industry-leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
For more information on the PC3-12800 Intel Extreme Series, please visit our product page here.
For more information on the PC3-10666 Intel Extreme Series, please visit our product page here.