The 28nm collaboration between ARM and GLOBALFOUNDRIES is no secret, but the first details regarding the next-generation SoC (system-on-chip) have today been unveiled at the Mobile World Congress in Barcelona.
With ARM-based chips expected to take over from Intel's x86 as the dominant force in ultra-mobile computing devices, the upcoming 28nm SoC is likely to power numerous next-generation products.
The SoC platform, described as "leading-edge", will be based on ARM's popular Cortex A9 processor and an optimised ARM physical IP. Built using GLOBALFOUNDRIES' 28nm High-K Metal Gate process, it promises to deliver a 40 per cent increase in computing performance and a 30 per cent decrease in power consumption when compared to 40/45nm parts, resulting in a notable 100 per cent increase in standby battery life.
As previously suggested, the 28nm SoC will be built using two unique processes; a 28nm super low power (SLP) process for mobile applications, and a 28nm high performance (HP) process for "applications requiring maximum performance".
GLOBALFOUNDRIES expects the parts to enter production in the second half of 2010 at its primary fabrication plan, Fab 1, located in Dresden, Germany. ARM, meanwhile, is expected to showcase the first 28nm wafer at the Mobile World Congress later today.
Official press release: GLOBALFOUNDRIES and ARM Define the Standard for Mobile Technology Platform Innovation at MWC 2010
