PRESS RELEASE
San Jose, California
– March 14, 2007 -- Super
Talent Technology, a leading manufacturer of DRAM memory modules and
flash products, today announced new 4 GigaByte DDR2 Fully Buffered
DIMMs (FB-DIMMs).
Super Talent’s new 4 GigaByte FB-DIMM modules were designed for use in the latest Intel® Xeon® server boards based on the Intel 5000P (Blackford) chipset. These JEDEC compliant 240-pin dual rank modules are organized as 512Megabit x 72. Thirty-six pieces of 256Megabit x4 DRAM chips in FBGA packages are used to build these modules. These modules have already been validated in the Intel 5000PSL and other leading server boards.
The core of these new modules is the Advanced Memory Buffer (AMB) chip. Super Talent selected the newest IDT™ AMB chip for use in its 4GB FB-DIMMs because of IDT’s leadership in AMB development and the IDT chip’s proven reliability in Super Talent’s 2 GigaByte FB-DIMMs.
“The 2-rank, monolithic architecture we used for these modules will have great appeal to white box server OEMs due to the cost efficiency and extreme reliability it offers” stated Joe James, Marketing Director at Super Talent Technology.
These modules are manufactured and tested in Super Talent’s state-of-the-art Silicon Valley factory. Every Super Talent server module built is hand tested in a server motherboard under load to ensure the highest level of reliability. These RoHS compliant products are sampling now to resellers and OEMs directly from Super Talent. Mass production will start in April 2007.
Super Talent’s new 4 GigaByte FB-DIMM modules were designed for use in the latest Intel® Xeon® server boards based on the Intel 5000P (Blackford) chipset. These JEDEC compliant 240-pin dual rank modules are organized as 512Megabit x 72. Thirty-six pieces of 256Megabit x4 DRAM chips in FBGA packages are used to build these modules. These modules have already been validated in the Intel 5000PSL and other leading server boards.
The core of these new modules is the Advanced Memory Buffer (AMB) chip. Super Talent selected the newest IDT™ AMB chip for use in its 4GB FB-DIMMs because of IDT’s leadership in AMB development and the IDT chip’s proven reliability in Super Talent’s 2 GigaByte FB-DIMMs.
“The 2-rank, monolithic architecture we used for these modules will have great appeal to white box server OEMs due to the cost efficiency and extreme reliability it offers” stated Joe James, Marketing Director at Super Talent Technology.
These modules are manufactured and tested in Super Talent’s state-of-the-art Silicon Valley factory. Every Super Talent server module built is hand tested in a server motherboard under load to ensure the highest level of reliability. These RoHS compliant products are sampling now to resellers and OEMs directly from Super Talent. Mass production will start in April 2007.
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