PRESS RELEASE
Credit-card sized COM module allows for rapid development of ultra-small customized embedded solutions
Taipei, Taiwan, 3rd May, 2012 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announcedthe latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.
Measuring 84mm x 55mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA EdenTM X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.
In addition, with the VIA COMe-8X91 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.
"The COM Express Mini form factor provides embedded customers the ideal platform for creating highly tailored solutions where real estate is at a premium," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA COMe-8X91 delivers an extremely ruggedized, power efficient solution for the creation of ultra compact embedded devices with a short time to market approach."
VIA COMe-8X91 Module
Available in the industry standard COM Express Mini form factor of 84mm x 55mm, the VIA COMe-8X91 module pairs an 800MHz VIA Eden X2 dual core processor and the VIA VX900 MSP for a low power, high performance platform. The VIA COMe-8X91 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS and either one displayport or one HDMI port (without HDCP).
Onboard I/O includes two SATA II ports, one GigaLAN port, eight USB 2.0 ports shared with one USB client port, one HD audio digital interface and two serial ports. System memory includes 1GB of onboard DDR3.
For more information about the VIA COMe-8X91 module please visit:
http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1710&tabs=1
For images related to the VIA COMe-8X91 please visit:
http://www.viagallery.com/Products/via-come-8x91-module.aspx
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw.
