VIA Embedded Platforms Support Included in Windows XP Embedded with Service Pack 1

Broadest device support and cutting-edge technologies included for developers of wide range of smart, feature-rich, connected devices based on VIA C3 E-Series processor and VIA Eden Platforms

Taipei, Taiwan, 22 October 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that the VIA C3 E-Series processor and VIA Eden Platform are fully supported in the new Microsoft Windows XP Embedded with Service Pack 1 (SP1) operating system, providing developers with the richest possible features and functionality for a wide array of Totally Connected devices.

Windows XP Embedded is the componentized version of the Microsoft Windows XP Professional operating system designed for use in a broad spectrum of smart, feature-rich, connected devices such as thin-clients, kiosks, industrial automation devices, gaming platforms, residential gateways, retail point of sale systems and advanced set-top boxes. It provides developers with the broadest device support and cutting-edge technologies found in Windows XP Professional, such as Microsoft Internet Explorer 6.0, Windows Media Player 8, DirectX 8 API, Windows Image Acquisition, USB support, IEEE 1394 and UPnP.

“VIA has worked hard to ensure that our embedded platforms meet and exceed industry standards of performance and functionality, so we are delighted that Microsoft has incorporated full support for these products in Windows XP Embedded with SP1,” said Paul Hsu, Executive Assistant to the President at VIA Technologies, Inc. “The feature-rich Windows XP Embedded operating system enables our customers to produce powerful connected devices that users can be comfortable and familiar with.”

The ultra low power consumption and native x86 performance and compatibility of the VIA C3 E-Series processor and fanless VIA Eden Platform is spurring the development of an innovative new range of feature-rich embedded Total Connectivity devices for the home, enterprise and mobile segments. Features offered by VIA embedded platforms include support for high speed DDR266 DRAM memory, integrated MPEG 2 decoder, IEEE 1394 and USB 2.0 communications, 6 channel 5.1 compatible surround sound, ATA-133 hard disk drive rapid access, digital TV-out, LVDS support and onboard LAN.

“Fast time to market is of the utmost importance to OEMs as they look to companies such as VIA to provide Windows Embedded solutions that assist them in quickly developing feature-rich embedded devices,” said Scott Horn, Director of the Embedded and Appliance Platforms Group at Microsoft Corp. “VIA’s C3 E-Series processor and VIA Eden Platform, coupled with Windows XP Embedded with SP1 will give OEMs the foundation they need to rapidly create the next generation of secure, reliable and smart connected devices.”

About VIA Technologies, Inc.

VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communications, optical media and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at the Company’s website at: http://www.via.com.tw.