Validation guarantees mainboard and CPU meet the requirements of Microsoft Windows CE .NET embedded operating system, enhancing acceptance by customers and OEMs
Taipei, Taiwan, 22 October 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that Microsoft Corp. has certified the ultra compact VIA EPIA Mini-ITX mainboard for the Windows CE .NET operating system after successful certification testing of the Board Support Package (BSP) and CPU, and has added it to the Supported BSP and Supported Processor list (URL: www.microsoft.com/windows/Embedded/ce.NET/evaluation/hardware/providedbsp.asp).
Windows CE .NET, the successor to Windows CE 3.0, has a complete feature set with an end-to-end development environment. Designed from the ground up for the embedded domain, Windows CE .NET delivers a robust real-time operating system for rapidly building the next generation of smart mobile and small footprint devices that require rich networking, hard real-time, and a small footprint, as well as rich multimedia and Web browsing capabilities.
By receiving the BSP and CPU certification, the highly integrated 17cm x 17cm mainboard is now part of a package that enables system developers to rapidly build Windows CE .NET based solutions based on the VIA EPIA Mini-ITX, eliminating extensive compatibility testing of the components with the operating system and thus speeding time to market.
“VIA is proud to be included on the supported BSP list as it provides a recognized quality assurance point and positive industry exposure,” said Paul Hsu, Executive Assistant to the President at VIA Technologies, Inc. “This certification by Microsoft will undoubtedly boost our growing presence in the embedded market as more designers discover our affordable yet powerful native x86 embedded platforms.”
VIA has been working closely with Microsoft to ensure compatibility across product lines. The VIA EPIA Mini-ITX mainboard is the latest key VIA product to receive such certification from Microsoft, with the VIA C3 processor validated for Windows CE versions 2.11 and 2.12, Windows CE .NET and version 4.1, and Windows XP Embedded operating systems.
“To jump-start development, OEMs look to companies such as VIA for engineering resources and skills that assist them in quickly developing their devices,” said Scott Horn, Director of the Embedded and Appliance Platforms Group at Microsoft. “VIA’s EPIA Mini-ITX mainboard, coupled with Windows CE .NET, will provide device OEMs with the foundation they need to rapidly create the next generation of smart connected Windows Powered devices.”
About the Microsoft Windows CE Board Support Package (BSP) Certification
The Microsoft Windows CE BSP Certification is designed to certify motherboard hardware technologies including the CPU and mainboard, as compatible with the Windows CE operating systems. BSP certification involves a process where system integrators provide a system, internally tested for compatibility with the operating system, to Microsoft for validation. The technologies are then certified as Windows CE compliant. BSP certification can save a systems integrator time in systems testing procedures.
Ultra Compact VIA EPIA Mini-ITX Mainboard
The VIA EPIA Mini-ITX mainboard provides system integrators and OEMs with a standardized ultra compact yet highly integrated platform that can be utilized across multiple mini PC, Information Station, Information Server, and Broadband Gateway product lines. With a footprint that measures only 170mm x 170mm, the VIA EPIA Mini-ITX mainboard is more than 33% smaller than any other motherboard form factor currently available on the market. It also comes with a rich feature set that includes a VIA C3™ processor (EBGA package), integrated AGP graphics and audio, USB, TV-Out connector, Ethernet networking, and SPDIF 5.1 audio channels that are not available on other small form factor motherboards.
Featuring a powerful native x86 processor core, 192KB full speed L1/L2 cache, and MMX™and 3DNow!™ support, the EPIA Mini-ITX delivers leading edge PC application and Internet performance on an embedded platform and is fully compatible with a complete range of Microsoft® Windows® XP, Windows 9x, Embedded Windows, and Windows CE operating systems. Multimedia performance is further enhanced by its integrated APG2X/4X graphics with full 3D/2D/video acceleration, including motion compensation for advanced video applications. Market-leading thermal characteristics make the VIA EPIA Mini-ITX the ideal solution for ergonomic fanless system designs for a variety of innovative low profile, small form factors, and translate into lower energy costs and longer battery life in mobile designs. The EPIA Mini-ITX is also available with the VIA Eden™ Platform for ultra low power Information Appliance designs. More information can be found at:
About VIA Technologies, Inc.
VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communications, optical media and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3™ processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at the Company’s website at: www.via.com.tw.
