Unveils innovative Spearhead Platform Initiative to enable PC OEMs and consumer electronics manufacturers to expedite time to market for high-potential next generation smart connected digital devices

Taipei, Taiwan, 6 January 2004 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the establishment of the VIA Embedded Platform Division (VEPD).

Headed by seasoned industry executive Mr. Steven S. Lee, VEPD combines the VIA Processor and VIA EPIA Mainboard groups into a single autonomous business unit focused on the design, development, and distribution of highly-integrated, low power x86 platforms targeted at a broad spectrum of high-potential markets for smart connected digital devices, ranging from Robotics and Telematics systems to Digital Entertainment Centers and Personal Gaming Consoles.

“The PC market is undergoing a fundamental shift, as consumers and corporate users alike demand a new generation of smaller, lighter, quieter, smarter and more stylish devices that better fit in with modern lifestyles,” commented Wenchi Chen, CEO and President of VIA Technologies, Inc. “With the establishment of VEPD, VIA aims to accelerate this transition by providing our customers with the most flexible and feature-rich dedicated x86 platforms that enable these innovative products to be brought to market quickly and more easily.”

At a press lunch held today in Taipei, Taiwan, Steven Lee outlined the core strategies for VEPD in 2004, and unveiled the company’s new Spearhead Platform Initiative that optimizes VIA’s core technology competences. Under this program, VEPD is developing a range of complete, interoperable platform solutions designed specifically for next generation devices, providing PC OEMs and Consumer Electronics manufacturers with an easily integrated platform that will greatly reduce product development costs and expedite time to market.

Lee also announced that VEPD will continue to expand its industry-leading range of low-power silicon solutions with the introduction of the new VIA CN400 Digital Media chipset, featuring the S3 Graphics UniChrome Pro core with hardware MPEG-2/-4 acceleration and DDR400 support, as well as higher performance and lower power VIA Eden-N processors with the revolutionary NanoBGA package.

In addition, Lee outlined VEPD’s plans to further enhance the highly successful line of VIA EPIA Mini-ITX mainboards, and to step up the pace of innovation in miniature system design with the introduction of the ground-breaking VIA Nano-ITX form factor, delivering full PC functionality on a footprint measuring just 12cm x 12cm.

“VIA has built up extensive expertise in the embedded space that enables us to offer a complete service to customers that goes beyond the component level, drawing upon the breadth and depth of our engineering resources in hardware and software to further shorten their time to market,” concluded Lee. “With our aggressive roadmaps and exciting new innovations such as the Nano-ITX and the Spearhead Platform Initiative, VIA is paving the way for rapid entry into these burgeoning markets, which will in turn extend our leadership in providing the innovative solutions our customers need to take full advantage of exciting new market opportunities.”

Please visit the VIA Embedded Platform Division website at: http://www.viaembedded.com