DRESDEN, GERMANY - 17 May 2004 - AMD (NYSE: AMD) marked an important milestone in the construction of its next-generation 300 millimeter (mm) manufacturing facility, AMD Fab 36, with a "topping-off" ceremony held today.

"AMD Fab 36 will play an important role in furthering AMD's leadership in world class manufacturing capabilities and will help ensure we have the capacity required to meet our customers' - and their customers' - needs for pervasive 64-bit computing solutions powered by AMD64 technology," said AMD chairman of the board, president and CEO Hector Ruiz. "Thanks to Hans Deppe's exemplary leadership of our Dresden operations, the support of Saxony, Germany, the European Commission and the many other dedicated professionals committed to the AMD Fab 36 project, I am proud to report that the entire AMD Fab 36 project is on plan, on time and on budget."

"Less than six months after we broke ground for AMD Fab 36, the first significant phase of our 300 mm wafer fab project has been completed successfully, and we are well on our way to meeting our overall project schedule," said Hans Deppe, vice president and general manager for AMD Saxony. "We have now begun to install the necessary infrastructure that will allow us to be ready for equipment towards the end of the year in preparation for our planned first production shipments in the first half of 2006."

The topping-off ceremony was attended by Germany's Federal Chancellor Gerhard Schröder, Prof. Dr. Georg Milbradt, Minister President of the Free State of Saxony, Hector Ruiz, as well as numerous other dignitaries representing European political, industry and banking interests.