VIA Telecom Attracts Senior Industry Talent

Leading figures in US and China telecommunications to strengthen VIA Telecom management team and drive 3G market adoption

San Diego, California, 23 September 2003 - VIA Telecom, Inc., a leading innovator and developer of Code Division Multiple Access (CDMA) chipsets today announced the appointment of two well-known and highly respected industry executives, Robert Gilmore and Yupu Xie, bringing a wealth of industry expertise to VIA Telecom.



Robert Gilmore joined VIA Telecom as the Vice President of Engineering in August 2003, and has held senior management positions at various high profile companies in the US. He was a co-founder of Mobilian, a company specializing in Bluetooth and Wireless LAN system ICs, where he was Vice President of Engineering. Robert was an early member of QUALCOMM; he was a Senior Vice President of Hardware Engineering, and was responsible for the OmniTRACS production system and the Globalstar ground segment, including gateways and phones at Qualcomm. He also served as the Senior Vice President of Engineering for the Consumer Products Division of QUALCOMM that was later acquired by Kyocera. He was also co-founder of ComStream Corporation in 1984, and worked at Linkabit Corporation from 1978 to 1984. Prior to this, Mr. Gilmore held positions in research and development at Bell Laboratories while a student at MIT.

Today, Robert Gilmore owns eight patents and is highly regarded for his design and development know-how. His technical expertise together with his managerial capabilities will certainly contribute to VIA Telecom's strategic advancement.

A seasoned telecommunications executive with over 30 years of experience in the China market, Yupu Xie was recently appointed the General Manager of VIA Telecom China. Prior to joining VIA Telecom, he was President and Vice Chairman of Eastern Communications Company Ltd, one of the major cellular communication equipment manufacturers. In addition to Mr Xie’s outstanding managerial skills gained in China’s mobile communications industry, his strong R&D background will make a significant contribution to VIA Telecom’s development in the fast growing China market.

Both executives will be presenting advances in 3G technology at the upcoming VIA Technology Forum 2003; Robert Gilmore at VTF Taipei on September 24 and Yupu Xie at VTF Beijing on September 26. For further information on VTF2003 please refer to the event website at: http://www.via.com.tw/vtf.



About VIA Telecom, Inc.

VIA Telecom is a leading innovator and developer of Baseband Processors for 3G CDMA2000 mobile applications used in a wide range of 3G devices spanning voice, data, and GPS-enabled applications. Headquartered in San Diego, California, VIA Telecom has design centers in San Diego and Fremont, California, and Hangzhou, China, and sales offices in the US, Taiwan, China, and Korea. For additional information, please visit the website at http://www.via-telecom.com