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16 October 2019, 13:11
Built on 10nm, some of these first GPUs are confirmed as including ray tracing hardware.
3 October 2019, 10:11
And Microsoft reveals another smaller dual-screen device, the pocketable Surface Duo.
9 August 2019, 11:21
12LP chip uses Arm 3D mesh interconnect tech to boost performance and efficiency.
10 July 2019, 13:21
At SEMICON West the firm discusses Co-EMIB, ODI, and MDIO advanced packaging.
18 March 2019, 12:11
And the chipmaker confirms its processors "are not susceptible," to SPOILER.
8 January 2019, 10:31
And it previews a hybrid 10nm Lakefield CPU architecture with Foveros 3D packaging.
13 December 2018, 10:11
And details of the first Foveros 'big.LITTLE' style CPU designs are shared.
12 December 2018, 16:11
IPC, efficiency and features boosts coming to Core and Xeon processors late 2019.