INTEL EXECS PUT SERVERS,
WIRELESS, MOBILE FRONT AND CENTER
Trends, Opportunities
Discussed on Final Day of European Intel Developer Forum
INTEL DEVELOPER FORUM, MUNICH, Germany, May 29,
2002 - Server industry trends, wireless solutions and innovations in mobile PCs
were the focuses of today's keynote addresses at the two-day Intel Developer
Forum in Germany.
Leading off was Mike Fister, senior vice
president and general manager of Intel's Enterprise Platforms Group. Before an
International Congress Centre assembly of approximately 1,000 developers,
engineers and other technical experts, Fister said that traditional server data
centers are evolving into diverse market segments with different platform
performance, form factor and power requirements. This trend, coupled with an
increasing number of businesses moving away from proprietary computing systems,
favors the open computing approach and flexibility that Intel-based servers are
delivering today.
In pronouncing 2002 as the company's biggest
year in enterprise computing, Fister pointed to the upcoming platform release of
the Intel® Itanium® 2 processor, which will become the second member of the
Itanium® processor family, and the recent introduction of several members of the
Intel® Xeon(tm) processor family.
Fister also revealed a number of
performance estimates for the forthcoming Itanium 2, announcing that the
processor has achieved record-setting results on key enterprise and other
technical applications. With its
higher data speeds and microarchitectural
enhancements, server and workstations based on the
Itanium 2 processor are expected to
deliver up to 1.5 to 2 times the
performance of today's Itanium-based systems, significantly extending the
product line's performance over RISC-based systems on key enterprise-class
applications.
The European audience also heard Fister
describe how Intel Architecture is expanding beyond traditional applications and
into such areas as carrier-grade and high-density servers, and the opportunity
these developments presents to the region's developer community. Several
European hardware vendors joined Fister onstage to demonstrate future products
and announce new plans for Intel-based servers. Bull demonstrated a 16-way
Itanium 2 prototype. Fujitsu Siemens Computers announced with Intel that the
companies are joining forces to provide continuous service availability on
Telecom and other Intel® Architecture based servers. The goal is to extend the
availability for carrier-grade, business-critical applications to 99.999 percent
or more using open standard technology.
Wireless Solutions
Tony Sica, vice president and marketing director of Intel's Wireless
Communications and Computing Group, said that as the Internet expands to
wireless, developer opportunities abound in delivering solutions to the
enterprise as well as end-users. Sica shared the latest developments in
delivering these wireless solutions with Intel® Personal Internet Client
Architecture, or Intel® PCA.
Sica focused developers' attention on Intel's
wireless client product strategy. Intel's wireless products are built around
three core technologies -- the Intel® XScale(tm) microarchitecture for
applications processing, the Intel® Micro Signal Architecture for signal
processing and Intel Wireless Flash Memory. These technologies are optimized for
higher performance and lower power consumption for users of wireless devices.
These technologies are the key ingredients of the Intel® Personal Internet
Client Architecture, Intel's development blueprint for designing wireless
handheld communication products that combine voice communications and Internet
access capabilities.
Future wireless technology from
Intel will integrate communications functions, outstanding processing power and
leadership memory features onto a single "Wireless Internet on a Chip," -- the
foundation for Intel's GSM/GPRS (2.5G) and WCDMA (3G) communications processors
currently under development. Intel has a 3G communications processor test chip
in its labs and will be introducing a 2.5G version based on the Wireless
Internet on a Chip technology later this year.
"Our next-generation technology
will provide new levels of performance at low levels of power to enable a class
of wireless Internet applications that will help drive the next wave of growth
for the wireless industry," Sica said.
Innovative Mobile Platforms
"Together, the industry can deliver exciting new platforms that meet the promise
of anytime, anywhere computing and security connectivity." So stated Anand
Chandrasekher, vice president and general manager of Intel's Mobile Platforms
Group, in urging the industry to design technologies and mobile PCs that deliver
secure wireless connectivity, high-performance and increased battery life in
order to offer new usage models for consumer and business.
Highlighting the company's efforts in
the mobile market, Chandrasekher said Intel Labs is creating innovative
technologies in such areas as wireless LAN and GPRS to foster easier wireless
communication in Europe.
Through a demonstration of Banias, the code
name for Intel's next-generation mobile processor architecture, Chandrasekher
addressed four mobility vectors that European users expect: simple, secure
wireless; thinner and lighter mobile PCs with great performance; and longer
battery life. "The exciting capabilities offered by Banias platforms deliver on
these elements." Banias will be available in the first half of 2003, and will be
based on a new core chip design.
Technical benefits of the recently announced
Mobile Intel® Pentium® 4 Processor-M also were discussed and demonstrated.
Chandrasekher showed off the processor's performance with a demo of a soft
decode of 1080i (HDTV quality) content on a notebook PC. Chandrasekher noted
that while incorporating all the advanced technologies of its desktop
counterpart, the Mobile Intel® Pentium 4 Processor-M includes such
mobile-specific features as Enhanced SpeedStep(tm) technology and Deeper Sleep
for low power state and small mobile packaging for thinner, lighter mobile PCs.
About IDF
The Intel Developer Forum is the technology industry's premier event for
hardware and software developers. Held worldwide throughout the year, IDF brings
together key industry players to discuss cutting-edge technology and products
for PCs, servers, communications equipment, and handheld clients. For more
information on IDF and Intel technology, visit
http://developer.intel.com.
Intel, the world's largest chip maker, is also
a leading manufacturer of computer, networking and communications products.
Additional information about Intel is available at
www.intel.com/pressroom.
