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Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory

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Düsseldorf, Germany, 30 June 2017 - Toshiba Electronics Europe (TEE) today launched the XG5 series, a new line of NVM Express® (NVMeTM[1] SSDs integrating 64-layer, 3D flash memories, offering up to 1TB[2]  capacity in a compact M.2[3]  form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.

As the third generation of the popular Toshiba XG Series, XG5 SSDs feature the latest 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™[4]  and utilize PCI EXPRESS® (PCIe®)[5]  Gen3 x 4 lanes and NVMe Revision 1.2.1 to deliver extremely high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write[6]. Compared to 6Gbit/s SATA storage, the XG5 Series is up to 5.4 times faster on sequential read performance and up to 3.8 times faster on sequential write performance[7]  with a maximum interface bandwidth of 32 GT/s[8].  Additionally, XG5’s feature-set also features an SLC cache for excellent performance to accelerate burst type workloads, such as those experienced routinely on Windows®[9] -based PCs, as well as improved standby power consumption reduced by over 50%[10]  to less than 3mW[11] , making these SSDs an excellent solution for high performance mobile computing.

XG5 Series SSDs will be available in three capacities, 256GB, 512GB and 1024GB, all on a single-sided M.2 2280 form factor. Self-encrypting drive (SED) models[12]  supporting TCG Opal Version 2.01 will also be offered, making the XG5 series highly suited to a wide range of applications including ultra-mobile PCs that prioritize performance and business applications requiring security.

The XG5 series SSDs were showcased at COMPUTEX TAIPEI 2017 in Taipei, Taiwan, from May 30 to June 3.

Toshiba will continue to strengthen its SSD storage solutions, utilizing cutting-edge flash memory technology to meet diverse market needs. For more information on Toshiba’s broad line of storage products, please visit:


[[1]] NVM Express and the NVM Express logo are registered trademarks, and NVMe is a trademark of NVM Express, Inc.

[2] Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1TB = 240 = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

[3] M.2 Type 2280

[4] Product density is identified based on the maximum density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.

[5] PCIe® and PCI EXPRESS® are registered trademarks of PCI-SIG.

[6] Read and write speed may vary depending on the host device, read and write conditions, and file size.

[7] Comparison is based on the theoretical maximum sequential bandwidth that SATA can provide vs the XG5 Series SSDs based on BiCS FLASH 64-layer technology

[8] Giga Transfers per second.

[9] Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.

[10] Compared to Toshiba XG3 series

[11] L1.2 in non-operation mode.

[12] Availability of the SED model line-up may vary by region.

About Toshiba Electronics Europe

Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, TEE offers a broad IC and discrete product line including high-end memory, microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including HDDs, SSDs, SD Cards and USB sticks.

TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Akira Morinaga.

For more company information visit TEE’s web site at