Press Release
INTEL DEVELOPER FORUM, San Francisco, Sept. 18, 2007 – Intel Corporation ad other industry leaders have formed the USB 3.0 Promoter Group to create a superspeed personal USB interconnect that can deliver 5 Gbps speed – 10 times the speed of today's connection. The technology, also developed by formed together with HP, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated, will target fast sync-and-go transfer applications in the PC, consumer, and mobile segments that are necessary as digital media becomes ubiquitous and file sizes increase up to and beyond 25 Giga-Bytes.USB (Universal Serial Bus) 3.0 will create a backward compatible standard with the same ease-of-use and plug and play capabilities of previous USB technologies. Targeting a bandwidth of 5 Gbps, the technology will draw from the same architecture of wired USB. In addition the USB 3.0 specification will be optimized for low power and improved protocol efficiency.
"USB 3.0 is the next logical step for the PC's most popular wired connectivity," said Jeff Ravencraft, technology strategist with Intel and President of the USB Developer Forum. "The digital era requires high-speed performance and reliable connectivity to move the enormous amounts of digital content now present in everyday life. USB 3.0 will meet this challenge while maintaining the ease-of-use experience that users have come to love and expect from any USB technology."
Intel formed the USB 3.0 Promoter Group with the understanding that the USB Implementers Forum (USB-IF) would act as the trade association for the USB 3.0 specification.
A completed USB 3.0 specification is expected by 1H'08. USB 3.0 implementations will initially be in the form of discrete silicon.
The USB 3.0 Promoter Group, consisting of HP, Intel Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated, is committed to preserving the existing USB device class driver infrastructure and investment, look-and-feel and ease-of-use of USB while continuing to expand the this great technologies capabilities.
