facebook rss twitter

Intel Centrino Mobile Technology

by Tarinder Sandhu on 29 January 2007, 16:12

Tags: Intel (NASDAQ:INTC)

Quick Link: HEXUS.net/qahrk

Add to My Vault: x

Intel Centrino Technology



Chances are that you've come across Centrino branding before. Centrino was Intel's first platform branding, launched March 2003, that aggregated key mobile-oriented technologies under one banner.

In a nutshell, then, Centrino is the umbrella term given to a specific combination of Intel mobile CPUs, associated Intel chipsets and Intel wireless connectivity, with a view to providing Centrino-approved notebooks with key usage-enhancing characteristics of greater performance, excellent connectivity, longer battery life, and thin-and-light form factors, respectively.

The history

Carmel

Intel introduced the Centrino brand - codenamed Carmel in the first incarnation - by requiring a compliant notebook to have, as a base, a Pentium M (Banias) processor, Intel 855GM/PM chipset (where the GM iterations provided on-board graphics), and Intel PRO/Wireless 2100B connection that interfaced with the system via a mini-PCI slot. A product refresh saw Intel introduce the Pentium M with the improved Dothan core and Intel PRO/Wireless 2200AB connection. Intel further added 802.11g (54Mbps) WiFi support after the standard was finalised in early 2004. By adhering to the Centrino platform, notebook manufacturers gained an obvious advantage by the fact that Intel effectively promised partners that the processor, chipset and wireless trio would all work flawlessly together, removing any potential integration headaches.

Sonoma

The Centrino platform evolved as Intel introduced newer mobile technologies to complement one another. Intel introduced a complete Centrino refresh - codenamed Sonoma - in January 2005.

Sonoma certification required the presence of an Intel Pentium M processor (Dothan core) that ran off a 533MHz FSB. The chipset was upgraded to Intel's i915GM/PM - which supported new technologies such as DDR2 SDRAM, PCI-Express connectivity, Intel's High-Definition Audio (HDA) and a native SATA interface for storage drives - and an Intel PRO/Wireless 2200BG or 2915ABG mini-PCI connection.

Sonoma's introduction, therefore, carried over and improved upon the incumbent Centrino platform (Carmel) in most respects.

The present

Intel introduced its third-generation Centrino technology - referred to as Centrino Duo - with the release of the Napa platform in January 2006.

With Napa, Intel added the first mobile dual-core processor support with its Core architecture - codenamed Yonah - that provided up to 40 per cent extra performance whilst reducing power by up to 40 per cent, when compared with the previous generation's processor.

The new processor was complemented by a new core-logic; the Intel 945GM/PM chipset, and WiFi support was upgraded to Intel's PRO/Wireless 3945ABG mini-PCIe adapter. In keeping with upgrading the Centrino platform with newer technologies as they're validated, a subsequent Napa refresh also included the Core 2 Duo (Merom) processor, which is what most mid-to-high-end Centrino Duo laptops are equipped with today.

The future

Intel will introduce its fourth-generation Centrino technology in April 2007. Codenamed Santa Rosa, it will feature Intel Core 2 Duo processor (Merom) that runs off an 800MHz Front-Side Bus (FSB) for greater available memory bandwidth from system RAM to the processor. Santa Rosa will also see a new supporting chipset, Intel 965GM/PM, with the chipset supporting integrated video upgraded to Intel's GMA X3000 graphics technology.

Codenamed Kedron, Intel is also introducing an all-new PRO/Wireless 4965AGN IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi module. Further, Santa Rosa will also incorporate Intel's Robson caching technology, which will utilise up to 4GiB of NAND flash memory to significantly reduce booting times for the operating system and programs. With hard drives being the slowest hardware in any modern system, the introduction of a large flash-based cache will have a huge effect on the user's overall mobile experience.

In summary, the Centrino platform is constantly evolving to include support for the latest mobile technologies. We can expect Intel to continue its tradition of launching a Centrino refresh every 12-to-18 months, and with each refresh the Centrino pillars of greater performance, excellent connectivity, longer battery life, and thin-and-light form factors, inevitably, become stronger.

So, the next time you see the Centrino branding on advertisements you'll know that it's an Intel-validated mobile platform that takes the guesswork out of core component compatibility and one that's changing to accommodate the very latest technologies.

Related HEXUS content

HEXUS.tv
Interview with Intel Marketing Man, Don MacDonald
Intel vPro interview - David Hollway
Intel vPro demonstration
Intel Quad-Core Xeon interview