Water Cooling 3!

For all you speed freaks

I have seen a lot of articles and tests comparing thermal pastes. All that stuff is silicone loaded with copper or silver powder. It is lousy as far as heat transfer goes, it's just better than nothing. If you really want some heat transfer you need metal to metal fusion. An example of this is solder. Solder uses metallic bonds to make a connection with good strength and conductivity. The bad part is that ordinary solder isn’t a very good conductor so it would not be that much better than thermal paste. A better material to use is indium. It transfers heat 92% as well as copper which is outstanding, and it also has a very low melting point which you will need to avoid damaging your peltier element.

Before you get too excited, indium has a few drawbacks. The first is that it would not be a good idea to bond indium to one of the new flip chips. The second is that it forms a poor bond with copper, but you can get around that by gold plating your copper part. The third is that I can't get a straight answer about bonding indium to the ceramic in Peltier elements.

The first problem has a simple answer, I'll just have to use thermal paste between the CPU and cold plate. Solving the second problem only requires money. The third problem will just have to be an experiment.

I have tried to make a cooling rig without compromises, and Indium has been a part of my plan since the beginning. When I have completed my cooler, Indium will be the subject of my first experiments.

Water Cooling 3!

For all you speed freaks

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