(Taipei, Taiwan) Silicon Power has unveiled its first overclocking DRAM product called the Xpower series for gamers, and all power users having a strong appetite for powerful memory. Incorporating FBGA package technology and original chips, Silicon Power Xpower DDR2-1066MHz 4GB (2GBX2) features high performance, superior heat spread ability and low power consumption. In Xpower overclocking series, the DDR2-1066MHz also supports CAS latency of 5-5-5-15 at 2.0 volts. Silicon Power exclusively developed Xpower series for the computer enthusiasts and gamers to DDR2 based computer systems that are demanded by overclockers.
By incorporating the advanced FBGA package technology and 8-layer PCB thus enabling higher module densities, Xpower DDR2-1066MHz with stable reliability and higher performance is designed for use in gamers’ PCs. The new Xpower series also features with exclusive heat sink. Reducing temperatures by dissipating heat more effectively, this new aluminum heat sink’s grid design transfers and removes heat better. This design reduces temperatures and increases the stability and reliability for powerful users pushing their systems to the extreme limit.
All Silicon Power's memory modules are built to the highest specifications with the best chips and undergo rigorous laboratory tests to ensure the highest performance and reliability. Silicon Power's memory modules are recognized for high quality, outstanding performance, excellent compatibility, superb stability and backed with a lifetime warranty.
Feature
●Suitable for gamers and all power users having a strong appetite for powerful memory
●Specific aluminum heat sinks to reduce the temperature efficiently
●CL: 5-5-5-15
●Capacity: 2GB/1GB
●FBGA package technology
●PCB layers: 8
●Voltage: 1.9V~2.0V
●Lifetime Warranty
