Have these arrived in the nick of time to prevent AMD eating Intel's lunch?

If it was against Milan, maybe. But these are pushed back to H1 2022 meaning they'll be competing with Genoa.

That and the purported ~1500mm^2 total die area is nuts for such a low amount of cores.

Hmm… maybe I'm missing something but isn't this just doing the same as AMD does with epyc…. the reason I say this is because according to Intel they just ‘glued together’ some desktop dies…. lol

LSG501
Hmm… maybe I'm missing something but isn't this just doing the same as AMD does with epyc…. the reason I say this is because according to Intel they just ‘glued together’ some desktop dies…. lol

Got the glue dig in there before me…

Better not be Super Glue then , every time I've tried it , it came unstuck.lol.

when will consumers see this technology in cpu's ?

Well the HBM cache could be very interesting, though unless they have an IO die I guess they would need one stack per CPU die.

All the images are just renders though, we can't really tell what they are doing yet